Items where Author is "Talledo, Jefferson"
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Article
Talledo, Jefferson (2021) Modeling of Leadframe Strip Warpage after Die Attach Cure Process. Journal of Engineering Research and Reports, 20 (3). pp. 50-56. ISSN 2582-2926
Talledo, Jefferson (2021) Understanding Package Crack Signatures in a Leadframe Semiconductor Package. Journal of Engineering Research and Reports, 20 (3). pp. 6-14. ISSN 2582-2926